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H810AEL2

Core Ultra Series 2 Arrow Lake-S, 2.5 GbE LAN, HDMI+LVDS+DP, M.2-2280 + M.2-2230
Featured Highlights
  Intel® Core™ Ultra i9/i7/i5 Socket-S Processor LGA1851
  Intel® H810 Chipset (vPro)
  Intel® Xe LPG Graphics
  2 SO-DIMM, DDR5 6400MHz for up to 192GB
  2 x SATA3.0, 2 x M.2 NVMe/SATA 
  2.5 GbE LAN + 1 GbE LAN, SIM
  2 x USB3.2 Gen1 + 2 x USB3.2 Gen2 
  7.1 ALC897 Audio Codec
  DC-in 19V Power Adapter (UL/CE/FCC Certified)
  OS Support: Windows 11/10 64-bit
  Applications: AI Edge, Digital Signage, Entertainment PC, Audio/Video PC, AI-IoT, High-end Gaming, etc.
   

SKU: H810AEL2
Product specifications
Processor

• Intel® Core™ Ultra Processors (Series 2) (LGA1851)
• Intel® Core™ Ultra 9-285, 7-265, 5-245/235/225 (65W)
•   Supports Intel® Hybrid Technology
•   Supports Intel® Turbo Boost Max 3.0 Technology
•   Supports Intel® Thermal Velocity Boost (TVB)
•   Supports Intel® Adaptive Boost Technology (ABT)
•   Integrated NPU for dedicated AI acceleration

Chipset

• Intel® H810 Chipset

Memory

• 2 x SO-DIMM DDR5 6400MHz unbuffered non-ECC Dual Channel I/O
• Supports up to 192GB 

Graphics

•   Intel® Xe LPG Graphics Architecture 
• 1 x HDMI®1.4 port, max. resolution up to 4096x2160 at 30Hz
• 1 x DisplayPort 1.2 max. resolution up to 4096x2160 at 60Hz
• 1 x eDP (Option) max. resolution Up to 5120 x 3200 @60 Hz
• 1 x LVDS  max. resolution Up to 1920 x 1200 @60 Hz

Network

• 1 x Intel® I226V 2.5 Gigabit LAN 
• 1 x  Intel® I219-LM Gigabit (10/100/1000 Mb/s) LAN
• Option: additional Gigabit LAN can be added by USB LAN module

Expansion Slot

• 1 x M.2 2230 E Key with CNVi Support (PCIe x1 & USB2.0) 
• 1 x M.2 2280 M Key (NVNe with PCIe x4, SATAIII)
• 1 x M.2 2242/3042/3052 B Key (PCIe x1, SATAIII, USB2.0)
• 1 x PCIe5.0 x16

Storage

• 2 x SATAIII 6Gb/s
• 1 x M.2 2280 (for SATA-6Gb/s SSD or PCIe 3.0 x4 NVMe)
• 1 x M.2 2242 (for SATA-6Gb/s SSD )
• Supports SATA RAID 0,1,5,10

Audio

• 1 x Speaker 2W 4-pin header with amplifier
• 1 x Audio Header (Front Panel Mic-in & Line-out)

Back Panel I/O

• 2 x USB3.2 Gen1
• 2 x USB3.2 Gen2
• 1 x HDMI® 1.4 port
• 1 x DP1.2 port
• 2 x LAN port
• 1 x Mic-in, 1 x Line-out
• 1 x DC-In 2.5mm Power Connector 

Internal I/O

• 1 x LVDS Header, 1 x Backlight Header; 1 x eDP Header (Optional)
• 2 x SATA III Connector, 1 x 5 pin SATA Power connector
• 2 x USB 2.0 (1 x 2.54 pitch header)
• 1 x Speaker 2W 4-pin header with amplifier
• 1 x Audio Header (Front Panel Mic-in & Line-out)
• 1 x MiAPI Header (support 10 x GPIO, 1 x SMBUS, 1 x UART, 1 x Watchdog)
• 1 x RS232/422/485 Header & 3 x RS232 Header
• DC-in 19V (5.1 mm / ID, 7.4 mm / OD) / ATX 4-pin 19V
• 1 x Front Panel Header; 2 x 4 pin Fan Header; Nano SIM slot

System BIOS

• AMI® UEFI BIOS 

Systemboard

Small Form Factor
Back I/O

 

Chassis

140D Small Form Factor with aluminum panel, Convertible to 1U Rackmount
• Dimensions: 7.00"(W) x 7.20"(D) x 1.40"(H), Weight: 3 lb. (Net) 10 lb. (gross with packaging)
• Cooling: Slim CPU Fan with Heatsink
• Color: Black as default color, option: Gun Grey, Silver, Gold. Other custom color available
• Supports VESA, wall mount or rackmount brackets 

Power Supply

• Power: DC-in 19V Power Adapter 2.5mm plug (UL/CE/FCC Certified)
• Power Cord: Standard US Power Cord included, European Power Cord available as option
• Energy Star Compliance, Idle mode at <1W

OS Support

• Windows 11/10 64-bit,

Applications

• Digital Signage, Entertainment PC, Edge AI, Audio/Video PC, AI-IoT, High-end Gaming, etc.

Environment
• Operating Temperature: -5~-20 to +40~+60 C (Please contact product specialist for details)
• Non operating temperature: -20 to 70 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, RoHS Certified
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Product specifications
Processor

• Intel® Core™ Ultra Processors (Series 2) (LGA1851)
• Intel® Core™ Ultra 9-285, 7-265, 5-245/235/225 (65W)
•   Supports Intel® Hybrid Technology
•   Supports Intel® Turbo Boost Max 3.0 Technology
•   Supports Intel® Thermal Velocity Boost (TVB)
•   Supports Intel® Adaptive Boost Technology (ABT)
•   Integrated NPU for dedicated AI acceleration

Chipset

• Intel® H810 Chipset

Memory

• 2 x SO-DIMM DDR5 6400MHz unbuffered non-ECC Dual Channel I/O
• Supports up to 192GB 

Graphics

•   Intel® Xe LPG Graphics Architecture 
• 1 x HDMI®1.4 port, max. resolution up to 4096x2160 at 30Hz
• 1 x DisplayPort 1.2 max. resolution up to 4096x2160 at 60Hz
• 1 x eDP (Option) max. resolution Up to 5120 x 3200 @60 Hz
• 1 x LVDS  max. resolution Up to 1920 x 1200 @60 Hz

Network

• 1 x Intel® I226V 2.5 Gigabit LAN 
• 1 x  Intel® I219-LM Gigabit (10/100/1000 Mb/s) LAN
• Option: additional Gigabit LAN can be added by USB LAN module

Expansion Slot

• 1 x M.2 2230 E Key with CNVi Support (PCIe x1 & USB2.0) 
• 1 x M.2 2280 M Key (NVNe with PCIe x4, SATAIII)
• 1 x M.2 2242/3042/3052 B Key (PCIe x1, SATAIII, USB2.0)
• 1 x PCIe5.0 x16

Storage

• 2 x SATAIII 6Gb/s
• 1 x M.2 2280 (for SATA-6Gb/s SSD or PCIe 3.0 x4 NVMe)
• 1 x M.2 2242 (for SATA-6Gb/s SSD )
• Supports SATA RAID 0,1,5,10

Audio

• 1 x Speaker 2W 4-pin header with amplifier
• 1 x Audio Header (Front Panel Mic-in & Line-out)

Back Panel I/O

• 2 x USB3.2 Gen1
• 2 x USB3.2 Gen2
• 1 x HDMI® 1.4 port
• 1 x DP1.2 port
• 2 x LAN port
• 1 x Mic-in, 1 x Line-out
• 1 x DC-In 2.5mm Power Connector 

Internal I/O

• 1 x LVDS Header, 1 x Backlight Header; 1 x eDP Header (Optional)
• 2 x SATA III Connector, 1 x 5 pin SATA Power connector
• 2 x USB 2.0 (1 x 2.54 pitch header)
• 1 x Speaker 2W 4-pin header with amplifier
• 1 x Audio Header (Front Panel Mic-in & Line-out)
• 1 x MiAPI Header (support 10 x GPIO, 1 x SMBUS, 1 x UART, 1 x Watchdog)
• 1 x RS232/422/485 Header & 3 x RS232 Header
• DC-in 19V (5.1 mm / ID, 7.4 mm / OD) / ATX 4-pin 19V
• 1 x Front Panel Header; 2 x 4 pin Fan Header; Nano SIM slot

System BIOS

• AMI® UEFI BIOS 

Systemboard

Small Form Factor
Back I/O

 

Chassis

140D Small Form Factor with aluminum panel, Convertible to 1U Rackmount
• Dimensions: 7.00"(W) x 7.20"(D) x 1.40"(H), Weight: 3 lb. (Net) 10 lb. (gross with packaging)
• Cooling: Slim CPU Fan with Heatsink
• Color: Black as default color, option: Gun Grey, Silver, Gold. Other custom color available
• Supports VESA, wall mount or rackmount brackets 

Power Supply

• Power: DC-in 19V Power Adapter 2.5mm plug (UL/CE/FCC Certified)
• Power Cord: Standard US Power Cord included, European Power Cord available as option
• Energy Star Compliance, Idle mode at <1W

OS Support

• Windows 11/10 64-bit,

Applications

• Digital Signage, Entertainment PC, Edge AI, Audio/Video PC, AI-IoT, High-end Gaming, etc.

Environment
• Operating Temperature: -5~-20 to +40~+60 C (Please contact product specialist for details)
• Non operating temperature: -20 to 70 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, RoHS Certified