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 Think Big. Go Small. Eco-Smart Computing         

OPS-H510/Q570

11th Gen. Rocket Lake, M.2-WiFi + M.2 SSD/NVMe, 4 USB + Type-C, HDMI+DP Supports vPro®
Featured Highlights
Intel® OPS standard module
Supports Intel® 11th Gen. Processor
Intel® H510/Q570 Platform (SOC)
Intel® UHD 750 Graphics, HDMI 2.0+DP 1.2+JAE 80pin OPS
2 DDR4 SO-DIMM for up to 64GB Memory
M.2 SSD/NVMe
Gigabit LAN, M.2-WiFi
4 USB 3.0/2.0, Type-C
5.1 ALC662 Audio Sound
DC12V or DC19V 60W Power Adapter (UL/CE/FCC Certified)
OS Support: Windows 10/11, IoT, Linux
Applications: Digital Signage, Set Top Box, Entertainment PC, etc.
 
SKU: BBCSOPSS510H1
Product specifications
Processor

• Intel® 11th/10th Generation Comet Lake processor
• LGA1200 socket series with 35W, 65W TDP
• Intel® Core™ i9-11900T, i9-11900 8C/16T 16M Cache
• Intel® Core™ i7-11700T, i7-11700 8C/16T 16M Cache
• Intel® Core™ i5-11400T, i5-11400, i5-11500, i5-11600 6C/12T 12M Cache
• Intel® Core™ i3-10105T, i3-10105 4C/8T 6M Cache
• Intel® Pentium® Gold G6405T, G6405, G6605 2C/4T 4M, Celeron® G5905T, G5905 2C/2T 4M

Chipset

• Intel® H510 Express Chipset
• Option: Intel® Q570 Express vPro® Technology

Graphics

• Intel® UHD 750 Graphics
• Supports Dual Graphics ports
• 1 x HDMI 2.0 4K 60Hz Graphics port
• 1 x DP 1.4 8K 60Hz Graphics port
• 1 x Standard JAE-80pin OPS Connector (HDMI signal 4096 x 2160 60Hz)

Memory

• 2 x DDR4 SO-DIMM
• 3200MHz unbuffered non-ECC (Dual Channel I/O)
• Supports up to 64GB

Expansion Slot

• 1 x M.2 2230 (for WiFi+BT or Other Module)
• 1 x M.2 2280 (for SATA-6Gb/s or PCIe x4 NVMe)

Storage

• 1 x M.2 2280 (for SATA-6Gb/s or PCIe x4 NVMe)
• Storage Capacity >1TB SSD

Network

• 1 x Intel® I219LM Gigabit (10/100/1000 Mb/s) LAN
• 1 x M.2 2230 (for 802.11 ac/n WiFi+BT or Other Module)
• Wake on LAN, PXE boot (Diskless) supported
• Option: additional Gigabit LAN can be added by USB LAN module

Audio

• Realtek® ALC662 6-channel (5.1)
• 2 x 3.5mm Analog Stereo Audio jacks

Back Panel I/O

• 1 x JAE-80pin Connector
• 1 x DC-In Power Connector

Internal I/O

• Optional 1 Serial COM header for front or back COM port

Other I/O

• RS232 Serial Signal via JAE-80pin OPS Connector 

Front Panel

• OPS-H510: 1 x USB 3.0 port, 3 x USB 2.0 ports
• OPS-Q570: 4 x USB 3.0 ports
• 1 x Type-C USB port (for Gigabit Ethernet, KB/Mouse, and other standard Type-C I/O functions)
• 1 x HDMI 2.0 port
• 1 x DP
• 1 x LAN port
• 2 x 3.5mm Audio jacks

Function

• 1 x TPM Header

System BIOS

• AMI® UEFI / Legacy BIOS

Chassis

OPS Form Factor Chassis: 7.9"(W) x 4.7"(D) x 1.18"(H)
• System Weight: 1.5 lb.

Power Supply

• Power Obtained from OPS Screen through JAE-80pin OPS connector
• Optional Power: DC12V or DC19V 60W Power Adapter 2.5mm plug (UL/CE/FCC Certified) 
• Energy Star Compliance, Idle mode at <1W 

OS Support

• Windows 10/11, IoT, Linux

Application

• Digital Signage, Set Top Box, Entertainment PC, etc.

Environment

• Operating Temperature: -5 to +45 C
• Non operating temperature: -20 to +70 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, RoHS Certified

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Product specifications
Processor

• Intel® 11th/10th Generation Comet Lake processor
• LGA1200 socket series with 35W, 65W TDP
• Intel® Core™ i9-11900T, i9-11900 8C/16T 16M Cache
• Intel® Core™ i7-11700T, i7-11700 8C/16T 16M Cache
• Intel® Core™ i5-11400T, i5-11400, i5-11500, i5-11600 6C/12T 12M Cache
• Intel® Core™ i3-10105T, i3-10105 4C/8T 6M Cache
• Intel® Pentium® Gold G6405T, G6405, G6605 2C/4T 4M, Celeron® G5905T, G5905 2C/2T 4M

Chipset

• Intel® H510 Express Chipset
• Option: Intel® Q570 Express vPro® Technology

Graphics

• Intel® UHD 750 Graphics
• Supports Dual Graphics ports
• 1 x HDMI 2.0 4K 60Hz Graphics port
• 1 x DP 1.4 8K 60Hz Graphics port
• 1 x Standard JAE-80pin OPS Connector (HDMI signal 4096 x 2160 60Hz)

Memory

• 2 x DDR4 SO-DIMM
• 3200MHz unbuffered non-ECC (Dual Channel I/O)
• Supports up to 64GB

Expansion Slot

• 1 x M.2 2230 (for WiFi+BT or Other Module)
• 1 x M.2 2280 (for SATA-6Gb/s or PCIe x4 NVMe)

Storage

• 1 x M.2 2280 (for SATA-6Gb/s or PCIe x4 NVMe)
• Storage Capacity >1TB SSD

Network

• 1 x Intel® I219LM Gigabit (10/100/1000 Mb/s) LAN
• 1 x M.2 2230 (for 802.11 ac/n WiFi+BT or Other Module)
• Wake on LAN, PXE boot (Diskless) supported
• Option: additional Gigabit LAN can be added by USB LAN module

Audio

• Realtek® ALC662 6-channel (5.1)
• 2 x 3.5mm Analog Stereo Audio jacks

Back Panel I/O

• 1 x JAE-80pin Connector
• 1 x DC-In Power Connector

Internal I/O

• Optional 1 Serial COM header for front or back COM port

Other I/O

• RS232 Serial Signal via JAE-80pin OPS Connector 

Front Panel

• OPS-H510: 1 x USB 3.0 port, 3 x USB 2.0 ports
• OPS-Q570: 4 x USB 3.0 ports
• 1 x Type-C USB port (for Gigabit Ethernet, KB/Mouse, and other standard Type-C I/O functions)
• 1 x HDMI 2.0 port
• 1 x DP
• 1 x LAN port
• 2 x 3.5mm Audio jacks

Function

• 1 x TPM Header

System BIOS

• AMI® UEFI / Legacy BIOS

Chassis

OPS Form Factor Chassis: 7.9"(W) x 4.7"(D) x 1.18"(H)
• System Weight: 1.5 lb.

Power Supply

• Power Obtained from OPS Screen through JAE-80pin OPS connector
• Optional Power: DC12V or DC19V 60W Power Adapter 2.5mm plug (UL/CE/FCC Certified) 
• Energy Star Compliance, Idle mode at <1W 

OS Support

• Windows 10/11, IoT, Linux

Application

• Digital Signage, Set Top Box, Entertainment PC, etc.

Environment

• Operating Temperature: -5 to +45 C
• Non operating temperature: -20 to +70 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, RoHS Certified